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STM32L443CC 데이터시트(PDF) 195 Page - STMicroelectronics |
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STM32L443CC 데이터시트(HTML) 195 Page - STMicroelectronics |
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195 / 207 page ![]() DocID028739 Rev 2 195/207 STM32L443CC STM32L443RC STM32L443VC Package information 204 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 58. WLCSP49 marking (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. Table 99. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm |
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