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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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CC3220MODASM2MONR 데이터시트(PDF) 8 Page - Texas Instruments |
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CC3220MODASM2MONR 데이터시트(HTML) 8 Page - Texas Instruments |
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8 / 100 page  8 CC3220MOD, CC3220MODA SWRS206B – MARCH 2017 – REVISED AUGUST 2017 www.ti.com Submit Documentation Feedback Product Folder Links: CC3220MOD CC3220MODA Table of Contents Copyright © 2017, Texas Instruments Incorporated Table of Contents 1 Module Overview ........................................ 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 3 1.4 Functional Block Diagrams ........................... 4 2 Revision History ......................................... 9 3 Device Comparison .................................... 10 3.1 Related Products .................................... 12 4 Terminal Configuration and Functions ............ 13 4.1 CC3220MODx and CC3220MODAx Pin Diagram .. 13 4.2 Pin Attributes ........................................ 15 4.3 Connections for Unused Pins ....................... 17 4.4 Pin Attributes and Pin Multiplexing .................. 18 4.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins ..................................... 32 4.6 Pad State After Application of Power to Chip, but Before Reset Release ............................... 33 5 Specifications ........................................... 34 5.1 Absolute Maximum Ratings ......................... 34 5.2 ESD Ratings ........................................ 34 5.3 Recommended Operating Conditions ............... 34 5.4 Current Consumption (CC3220MODS and CC3220MODAS) .................................... 35 5.5 Current Consumption (CC3220MODSF and CC3220MODASF) ................................... 36 5.6 TX Power and IBAT Versus TX Power Level Settings .............................................. 37 5.7 Brownout and Blackout Conditions ................. 39 5.8 Electrical Characteristics ............................ 40 5.9 CC3220MODAx Antenna Characteristics ........... 41 5.10 WLAN Receiver Characteristics .................... 42 5.11 WLAN Transmitter Characteristics .................. 42 5.12 Reset Requirement ................................. 42 5.13 Thermal Resistance Characteristics for MOB and MON Packages ..................................... 43 5.14 Timing and Switching Characteristics ............... 43 6 Detailed Description ................................... 56 6.1 Overview ............................................ 56 6.2 ARM® Cortex®-M4 Processor Core Subsystem .... 56 6.3 Wi-Fi® Network Processor Subsystem .............. 57 6.4 Security .............................................. 59 6.5 Power-Management Subsystem .................... 62 6.6 Low-Power Operating Mode ........................ 62 6.7 Memory .............................................. 64 6.8 Restoring Factory Default Configuration ............ 66 6.9 Boot Modes .......................................... 67 6.10 Device Certification and Qualification ............... 68 6.11 Module Markings .................................... 71 6.12 End Product Labeling ............................... 72 6.13 Manual Information to the End User ................ 72 7 Applications, Implementation, and Layout ....... 73 7.1 Typical Application .................................. 73 7.2 Device Connection and Layout Fundamentals ...... 75 7.3 PCB Layout Guidelines ............................. 76 8 Environmental Requirements and Specifications ........................................... 82 8.1 PCB Bending ........................................ 82 8.2 Handling Environment .............................. 82 8.3 Storage Condition ................................... 82 8.4 Baking Conditions ................................... 82 8.5 Soldering and Reflow Condition .................... 83 9 Device and Documentation Support ............... 84 9.1 Third-Party Products Disclaimer .................... 84 9.2 Development Tools and Software ................... 84 9.3 Firmware Updates ................................... 84 9.4 Device Nomenclature ............................... 85 9.5 Documentation Support ............................. 86 9.6 Trademarks .......................................... 88 9.7 Electrostatic Discharge Caution ..................... 88 9.8 Export Control Notice ............................... 88 9.9 Glossary ............................................. 88 10 Mechanical, Packaging, and Orderable Information .............................................. 89 10.1 Mechanical, Land, and Solder Paste Drawings ..... 89 10.2 Package Option Addendum ......................... 90 |
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