LAN91C100FD datasheet(78/79 Pages) SMSC

78 / 79 page

FEAST Fast Ethernet Controller with Full Duplex Capability

Rev. 10/14/2002

Page 78

SMSC DS – LAN91C100FD Rev. D

PRELIMINARY

Figure 10.2 - 208 Pin TQFP Package Outlines

Table 10.2 - 208 Pin TQFP Package Outlines

MIN

NOMINAL

MAX

REMARK

1.60

Overall Package Height

0.05

0.15

Standoff

1.35

1.45

Body Thickness

29.80

30.20

X Span

27.90

28.10

X Body Size

29.80

30.20

Y Span

27.90

28.10

Y body Size

0.09

0.23

Lead Frame Thickness

0.45

0.60

0.75

Lead Foot Length

1.00

Lead Length

0.50 Basic

Lead Pitch

Lead Foot Angle

0.17

0.22

0.27

Lead Width

0.08

Lead Shoulder Radius

0.08

0.20

Lead Foot Radius

ccc

0.08

Coplanarity

Notes:

Controlling Unit: millimeter.

Tolerance on the true position of the leads is ± 0.04 mm maximum.

Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm.

Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

Details of pin 1 identifier are optional but must be located within the zone indicated.

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