| 전자부품 데이터시트 검색엔진 |
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AR0134CSSC00SUEAD 데이터시트(PDF) 28 Page - ON Semiconductor |
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AR0134CSSC00SUEAD 데이터시트(HTML) 28 Page - ON Semiconductor |
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28 / 29 page ![]() AR0134CS www.onsemi.com 28 PACKAGE DIMENSIONS ILCC48 10x10 CASE 847AE ISSUE O Notes: 1. Dimensions in mm. Dimensions in () are for reference only. 2. Encapsulant: Epoxy. 3. Substrate material: Plastic laminate 0.25 thickness. 4. Lid material: Borosilicate glass 0.4 ±0.04 thickness. 5. Refractive index at 20C = 1.5255 @ 546 nm and 1.5231 @ 588 nm. 6. Double side AR Coating: 530−570 nm R< 1%; 420−700 nm R < 2%. 7. Lead finish: Gold plating, 0.5 mm min. thickness. 8. Image sensor die: 0.2 mm thickness. 9. Maximum rotation of optical area relative to package edges: 0.75 °. 10. Maximum tilt of optical area relative to substrate plane D: 25 mm. 11. Maximum tilt of cover glass relative to optical area plane E: 50 mm. |
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