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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LWQ38G 데이터시트(PDF) 13 Page - OSRAM GmbH |
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LWQ38G 데이터시트(HTML) 13 Page - OSRAM GmbH |
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13 / 22 page  Version 1.3 LW Q38G 2015-09-01 13 Recommended Solder Pad 10) page 21 Reflow soldering Empfohlenes Lötpaddesign 10) Seite 21 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. 0.8 (0.031) 0.7 (0.028) OHAPY606 0.8 (0.031) |
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