PC7447 datasheet(44/66 Pages) ATMEL

44 / 66 page

PC7457/47 [Preliminary]

5345B–HIREL–02/04

Substrate Capacitors for the PC7447, 360 CBGA

Figure 26 shows the connectivity of the substrate capacitor pads for the PC7447, 360 CBGA. All capacitors are 100 nF.

Figure 26. Substrate Bypass Capacitors for the PC7447, 360 CBGA

Package Parameters for

the PC7457, 483 CBGA

The package parameters are as provided in the following list. The package type is

29 × 29 mm, 483-lead ceramic ball grid array (CBGA).

Package outline

29 mm × 29 mm

Interconnects

483 (22 × 22 ball array - 1)

Pitch

1.27 mm (50 mil)

Minimum module height

–

Maximum module height

3.22 mm

Ball diameter

0.89 mm (35 mil)

C1-2

C1-1

C2-1

C3-1

C4-1

C5-1

C6-1

C6-2

C5-2

C4-2

C3-2

C2-2

C18-1

C18-2 C17-2 C16-2

C15-2 C14-2

C13-2

C13-1

C14-1

C15-1

C16-1

C17-1

A1 CORNER

GND

VDD

GND

VDD

GND

OVDD

GND

VDD

GND

VDD

GND

VDD

GND

VDD

GND

VDD

GND

OVDD

C10

GND

VDD

C11

GND

VDD

C12

GND

VDD

C13

GND

VDD

C14

GND

VDD

C15

GND

VDD

C16

GND

OVDD

C17

GND

VDD

C18

GND

OVDD

C19

GND

VDD

C20

GND

VDD

C21

GND

OVDD

C22

GND

VDD

C23

GND

VDD

C24

GND

VDD

Capacitor

Pad Number

-1

-2

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