PC7410 datasheet(13/54 Pages) ATMEL

13 / 54 page

PC7410

2141D–HIREL–02/04

Internal Package Conduction

Resistance

Figure 4 depicts the primary heat transfer path for a package with an attached heat sink

mounted on a printed circuit board.

Heat generated on the active side of the chip is conducted through the silicon, then

through the heat sink attach material (or thermal interface material) and finally to the

heat sink where it is removed by forced-air convection.

Since the silicon thermal resistance is quite small, for a first-order analysis the tempera-

ture drop in the silicon may be neglected. Thus, the heat sink attach material and the

heat sink conduction/convective thermal resistances are the dominant terms.

Figure 4. C4 Package with Heat Sink Mounted on a Printed Circuit Board

Thermal Management

Information

This section provides thermal management information for the ceramic ball grid array

(CBGA) package for air-cooled applications. Proper thermal control design is primarily

dependent upon the system-level design – the heat sink, airflow and thermal interface

material. To reduce the die-junction temperature, heat sinks may be attached to the

package by several methods: adhesive, spring clip to holes in the printed-circuit board

or package and mounting clip and screw assembly; see Figure 5. This spring force

should not exceed 5.5 pounds of force. Ultimately, the final selection of an appropriate

heat sink depends on many factors such as thermal performance at a given air velocity,

spatial volume, mass, attachment method, assembly and cost.

Figure 5. CBGA Package Cross-section with Heat Sink Options

External Resistance

Internal Resistance

Radiation

Convection

Heat Sink

Thermal Interface Material

Die/Package

Die Junction

Package/Leads

Printed Circuit Board

Radiation

Convection

Printed-Circuit Board

Adhesive or

Thermal Interface Material

Heat Sink Clip

Heat Sink

Option

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