PC7410 datasheet(30/54 Pages) ATMEL

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PC7410

2141D–HIREL–02/04

Preparation for

Delivery

Handling

MOS devices must be handled with certain precautions to avoid damage due to accu-

mulation of static charge. Input protection devices have been designed in the chip to

minimize the effect of static buildup. However, the following handling practices are

recommended:

•

Devices should be handled on benches with conductive and grounded surfaces.

•

Ground test equipment, tools and operator.

•

Do not handle devices by the leads.

•

Store devices in conductive foam or carriers.

•

Avoid use of plastic, rubber or silk in MOS areas.

•

Maintain relative humidity above 50% if practical.

•

For CI-CGA packages, use specific tray to take care of the highest height of the

package compared with the normal CBGA.

Package Mechanical Data

Parameters

The package parameters are as provided in the following list. The package type is

25x25 mm, 360-lead CBGA, HiTCE and CI-CGA.

The following remarks apply to Figure 26 and Figure 27:

•

Dimensions and tolerancing are as per ASME Y14.5M-1994.

•

All dimensions are in millimeters.

•

Top side A1 corner index is a metallized feature with various shapes. Bottom side

A1 corner is designated with a ball missing from the array.

•

Dimension B is the maximum solder ball diameter measured parallel to datum A.

•

D2 and E2 define the area occupied by the die and underfill. Actual size of this area

may be smaller than shown. D3 and E3 are the minimum clearance from the

package edge to the chip capacitors.

Table 15. Package Parameters

Parameter

Package outline

25 mm x 25 mm

Interconnects

360 (19 x 19 ball array minus one)

Pitch

1.27 mm (50 mil)

Minimum module height

2.65 mm (CBGA, HiTCE), 3.65 mm (CI-CGA)

Maximum module height

3.20 mm (CBGA), 3.24 mm (HiTCE), 4.20 mm (CI-CGA)

Ball or column diameter

0.89 mm (35 mil)

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