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OPA187, OPA2187, OPA4187

SBOS807B – DECEMBER 2016 – REVISED OCTOBER 2018

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Product Folder Links: OPA187 OPA2187 OPA4187

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Copyright © 2016–2018, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA187

OPA187

UNIT

5 PINS

8 PINS

DBV (SOT-23)

DGK

(VSSOP)

D (SOIC)

Junction-to-ambient thermal resistance

273.8

159

100.1

°C/W

Junction-to-case (top) thermal resistance

126.8

37

42.4

°C/W

Junction-to-board thermal resistance

85.9

49

41.0

°C/W

Junction-to-top characterization parameter

10.9

1.2

4.8

°C/W

Junction-to-board characterization parameter

84.9

77.1

40.3

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2187

OPA2187

UNIT

8 PINS

DGK (VSSOP)

D (SOIC)

Junction-to-ambient thermal resistance

159

100.1

°C/W

Junction-to-case (top) thermal resistance

37

42.4

°C/W

Junction-to-board thermal resistance

49

41.0

°C/W

Junction-to-top characterization parameter

1.2

4.8

°C/W

Junction-to-board characterization parameter

77.1

40.3

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4187

OPA4187

UNIT

14 PINS

16 PINS

PW (TSSOP)

D (SOIC)

RUM (WQFN)

Junction-to-ambient thermal resistance

107.8

83.8

35.3

°C/W

Junction-to-case (top) thermal resistance

29.6

70.7

32.7

°C/W

Junction-to-board thermal resistance

52.6

59.5

12.9

°C/W

Junction-to-top characterization parameter

1.5

11.6

0.3

°C/W

Junction-to-board characterization parameter

51.6

37.7

12.9

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

3.3

°C/W