AD9154 datasheet(11/124 Pages) AD

11 / 124 page

Data Sheet

AD9154

Rev. C | Page 11 of 124

ABSOLUTE MAXIMUM RATINGS

Table 10.

Parameter

Rating

I120 to Ground

−0.3 V to AVDD33 + 0.3 V

SERDINx±, VTT, SYNCOUTx±, and

TXENx

−0.3 V to SIOVDD33 + 0.3 V

OUTx±

−0.3 V to AVDD33 + 0.3 V

SYSREF±

GND − 0.5 V

CLK± to Ground

−0.3 V to PVDD12 + 0.3 V

RESET, IRQ, CS, SCLK, SDIO, SDO,

and PDP OUTx to Ground

−0.3 V to IOVDD + 0.3 V

LDO_BYP1

−0.3 V to SVDD12 + 0.3 V

LDO_BYP2

−0.3 V to PVDD12 + 0.3 V

Ambient Operating Temperature (TA)

−40°C to +85°C

Junction Temperature

125°C

Storage Temperature

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

The exposed pad (EPAD) must be soldered to the ground plane

for the 88-lead LFCSP. The EPAD provides an electrical,

thermal, and mechanical connection to the board.

Typical θJA, θJB, and θJC values are specified for a 4-layer, JESD51-7

high effective thermal conductivity test board for leaded

surface-mount packages. θJA is obtained in still air conditions

(JESD51-2). Airflow increases heat dissipation, effectively reducing

θJA. θJB is obtained following double-ring cold plate test conditions

(JESD51-8). θJC is obtained with the test case temperature moni-

tored at the bottom of the exposed pad.

ΨJT and ΨJB are thermal characteristic parameters obtained with

θJA in still air test conditions.

Junction temperature (TJ) can be estimated using the following

equations:

TJ = TT + (ΨJT × P),

TJ = TB + (ΨJB × P)

where:

TT is the temperature measured at the top of the package.

P is the total device power dissipation.

TB is the temperature measured at the board.

Table 11. Thermal Resistance

Package

θJA

θJB

θJC

ΨJT

ΨJB

Unit

88-Lead LFCSP1

22.6

5.59

1.17

0.1

5.22

°C/W

The exposed pad must be securely connected to the ground plane.

ESD CAUTION

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