RF64W datasheet(75/76 Pages) HOPE

75 / 76 page

ADVANCED COMMUNICATIONS & SENSING

Page 75 of 76

RF64

Tel: +86-755-82973805 Fax: +86-755-82973550 E-mail: sales@hoperf.com http://www.hoperf.com

bbb

C A B

8. Packaging Information

8.1. Package Outline Drawing

RF64 is available in a 32-lead TQFN package as shown in Figure 59 below.

DIMENSIONS

INCHES

MILLIMETERS

DIM

MIN NOM MAX MIN NOM MAX

.028

.031 0.70

0.80

A1 .000

.002 0.00

0.05

(.008)

(0.20)

PIN 1

.007 .010 .012 0.18 0.25 0.30

INDICATOR

(LASER MARK)

.193 .197 .201 4.90 5.00 5.10

D1 .142 .146 .150 3.60 3.70 3.80

.193 .197 .201 4.90 5.00 5.10

E1 .142 .146 .150 3.60 3.70 3.80

.020 BSC

0.50 BSC

.012 .016 .020 0.30 0.40 0.50

aaa C

SEATING

PLANE

aaa

bbb

.003

.004

0.08

0.10

LxN

E/2

NOTES:

e/2

D/2

bxN

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.

Figure 59: Package Outline Drawing

8.2. PCB Land Pattern

DIMENSIONS

(C)

DIM

INCHES

(.197)

.165

.146

.020

.012

.031

.228

MILLIMETERS

(5.00)

4.20

3.70

0.50

0.30

0.80

5.80

NOTES:

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD

SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.

FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR

FUNCTIONAL PERFORMANCE OF THE DEVICE.

4. SQUARE PACKAGE - DIMENSIONS APPLY IN BOTH " X " AND " Y " DIRECTIONS.

Figure 60: PCB Land Pattern

RF64W 데이터시트(PDF) 75 Page - HOPE Microelectronics CO., Ltd.

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