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PCF8813 데이터시트(PDF) 63 Page - NXP Semiconductors |
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PCF8813 데이터시트(HTML) 63 Page - NXP Semiconductors |
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63 / 72 page ![]() 2004 Mar 05 63 Philips Semiconductors Product specification (67 + 1) × 102 pixels matrix LCD driver PCF8813 20 BONDING PAD INFORMATION handbook, full pagewidth MGW797 x y 0, 0 R67 (ICON ROW) T8 T8 T8 8 Rows 8 Rows 8 Rows 8 Rows 32 Columns 32 Columns 38 Columns 8 Rows 8 Rows 8 Rows 8 Rows alignment & dummy alignment mark alignment mark dummy alignment & dummy Fig.55 Bonding pad locations. (1) Can be used to tie-off unused input pads to the power supply voltage or to ground. (2) Used only for icons. |
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