MPC852T datasheet(6/80 Pages) FREESCALE

6 / 80 page

MPC852T Hardware Specifications, Rev. 3.1

Freescale Semiconductor

Power Dissipation

Table4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1

mode, where CPU frequency is twice bus speed.

Table 3. MPC852T Thermal Resistance Data

Rating

Environment

Symbol

Value

Unit

Junction to ambient 1

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting

site (board) temperature, ambient temperature, air flow, power dissipation of other components on the

board, and board thermal resistance.

Natural convection

Single layer board (1s)

R JA

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal

°C/W

Four layer board (2s2p)R JMA

Per JEDEC JESD51-6 with the board horizontal

Air flow (200 ft/min)

Single layer board (1s)R JMA

Four layer board (2s2p)R JMA

Junction to board 4

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board

temperature is measured on the top surface of the board near the package.

R JB

Junction to case 5

Indicates the average thermal resistance between the die and the case top surface as measured by the

cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case

temperature. For exposed pad packages where the pad would be expected to be soldered, junction to

case thermal resistance is a simulated value from the junction to the exposed pad without contact

resistance.

R JC

Junction to package top 6

Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2

Natural convection

Air flow (200 ft/min)

Table 4. Power Dissipation (PD)

Die Revision

Bus Mode

Frequency

(MHz)

Typical 1

Typical power dissipation is measured at 1.9 V.

Maximum 2

Unit

1:1

110

140

150

180

2:1

140

160

170

200

100

210

250

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