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TESEO-LIV3F 데이터시트(PDF) 33 Page - STMicroelectronics

부품명 TESEO-LIV3F
상세설명  Tiny GNSS module
PDF  37 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TESEO-LIV3F 데이터시트(HTML) 33 Page - STMicroelectronics

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DS12152 Rev 7
33/37
Teseo-LIV3F
Reflow soldering profile
35
19
Reflow soldering profile
The Teseo-LIV3F is a high temperature strength surface mount GNSS module supplied on a
18 pin, 6-layer PCB. The final assembly recommended reflow profiles are indicated here
below.
Soldering phase has to be executed with care: in order to avoid undesired melting
phenomenon, particular attention has to be taken on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on following
recommendations.
Figure 10. Soldering profiles
Table 11. Soldering profile values
Profile feature
PB-free assembly
Average ramp-up rate (TSMAX to Tp)3 °C/sec max
Preheat:
– Temperature min (TSmin)
– Temperature max (TSmax)
–Time (tSmin to tSmax) (tS)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature (TL)
–Time (tL)
217° C
60-70 sec
Peak temperature (TP)
245 +/- 5 °C
Time within 5 °C of actual peak temperature
(TP)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minute max.



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