STM32WB5MMG datasheet(17/31 Pages) STMICROELECTRONICS

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Thermal characteristics

The thermal characterics of the STM32WB5MMG are defined below and the constant values are given in Table 4

•

ϴJA, Junction-to-ambient thermal resistance (EIA/JESD51-2 and EIA/JESD51-6):

ϴJA, = (TJ-TA) / PH,

where TJ= junction temperature, TA= ambient temperature, PH= power dissipation.

ϴJA, represents the resistance to the heat flows from the chip to ambient air. It is an indicator of package

heat dissipation capability. Lower ϴJA, means better overall thermal performance.

•

ΨJT, Junction-to-top-center thermal characterization parameter (EIA/JESD51-2 and EIA/JESD51-6):

ΨJT = (TJ-TT) / PH,

where TT= temperature at the top-center of the package.

ΨJT is used for estimating the junction temperature by measuring TT in an actual environment.

•

ϴJC, Junction-to-case thermal resistance :

ϴJC = (TJ–TC) / PH,

where TC= case temperature attached with a cold plate.

ϴJC represents the resistance to the heat flows from the chip to package top case. ϴJC is important when

external heat sink is attached on package top.

•

ϴJB, Junction-to-board thermal resistance (EIA/JESD51-8):

ϴJB = (TJ–TB) / PH,

where TB= board temperature with ring cold plate fixture applied.

ϴJB represents the resistance to the heat flows from the chip to PCB. JBis used in compact thermal

models for system-level thermal simulation.

Table 4. STM32WB5MMG thermal characteristics

Symbol

TJ(°C)

TC(°C)

ΨJT(°C/W)

ϴJA(°C/W)

ϴJB(°C/W)

ϴJC(°C/W)

Value

97.36

96.98

37.36

0.38

24.58

16.21

STM32WB5MMG

Thermal characteristics

DS13252 - Rev 1

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