Contents

1

Introduction .......................................................................2

2

Description ........................................................................3

3

Available peripherals ..............................................................4

4

Pin description ....................................................................5

5

Recommendations.................................................................9

5.1

Pin recommendations ........................................................... 9

5.2

Layout recommendations....................................................... 10

5.2.1

STM32WB5MMG placement............................................... 10

5.2.2

Enclosure effects........................................................ 10

5.2.3

Ground plane .......................................................... 12

5.2.4

Sensitive GPIOs ........................................................ 12

5.2.5

Four layer reference board design .......................................... 12

6

Electrical characteristics..........................................................15

6.1

Operating conditions........................................................... 15

6.2

Power consumption ........................................................... 15

6.3

RF characteristics ............................................................. 15

6.4

Antenna radiation patterns and efficiency ......................................... 16

7

Thermal characteristics ...........................................................17

8

Solder re-flow recommendation ...................................................18

9

Package information..............................................................19

9.1

SiP-LGA86 package information ................................................. 19

9.1.1

Device marking for SiP-LGA86 ............................................. 21

10

Ordering information .............................................................22

11

Tape and reel packing ............................................................23

12

Certification ......................................................................24

12.1

CE certification ............................................................... 24

12.2

FCC certification .............................................................. 24

12.3

ISED certification.............................................................. 25

12.4

JRF certification............................................................... 25

STM32WB5MMG

Contents

DS13252 - Rev 1

page 27/31