EMC1702 datasheet(11/60 Pages) MICROCHIP

11 / 60 page

EMC1702



2020 Microchip Technology Inc.

DS20006455A

Chapter 2 Electrical Characteristics

Note 2.1

Stresses at or above those values listed could cause permanent damage to the device.

This is a stress rating only, and functional operation of the device at any other condition

above those indicated in the operation sections of this specification is not implied.

Prolonged stresses above the stated operating levels and below the Absolute Maximum

Ratings may degrade device performance and lead to permanent damage.

Note 2.2

All voltages are relative to ground.

Note 2.3

The Package Power Dissipation specification assumes a thermal via design with the

thermal landing be soldered to the PCB ground plane with four 12 mil vias.

Note 2.4

Junction to Ambient (JA) is dependent on the design of the thermal vias. Without thermal

vias and a thermal landing, the JA is approximately 60°C/W including localized PCB

temperature increase.

Table 2.1 Absolute Maximum Ratings

Voltage on 5V tolerant pins

-0.3 to 5.5

Voltage on 2V tolerant pins

-0.3 to 2

Voltage on VDD, SENSE- and SENSE+ pins

-0.3 to 26

Voltage on any other pin to GND

-0.3 to 4

Voltage between Sense pins ( |(SENSE+ - SENSE-)| )

< 6

Package Power Dissipation

0.5W up to TA = 85°C

Junction to Ambient (JA) (QFN12 package)

°C/W

Operating Ambient Temperature Range

-40 to 85

°C

Storage Temperature Range

-55 to 150

°C

ESD Rating - SMCLK, SMDATA, ALERT, THERM pins - HBM

4000

ESD Rating - All other pins - HBM

2000

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