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IRFZ44STRLPBFA 데이터시트(PDF) 1 Page - Vishay Siliconix

부품명 IRFZ44STRLPBFA
상세설명  Power MOSFET
PDF  11 Pages
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제조업체  VISHAY [Vishay Siliconix]
홈페이지  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

IRFZ44STRLPBFA 데이터시트(HTML) 1 Page - Vishay Siliconix

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IRFZ44S, IRFZ44L, SiHFZ44S, SiHFZ44L
www.vishay.com
Vishay Siliconix
S21-0932-Rev. D, 13-Sep-2021
1
Document Number: 91293
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Power MOSFET
FEATURES
• Advanced process technology
• Surface-mount (IRFZ44S, SiHFZ44S)
• Low-profile through-hole (IRFZ44L, SiHFZ44L)
• 175 °C operating temperature
• Fast switching
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Note
* This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
DESCRIPTION
Third generation power MOSFETs from Vishay utilize
advanced processing techniques to achieve extermely low
on resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
power MOSFETs are well known for, provides the designer
with an extermely efficient reliabel deviece for use in a wide
variety of applications.
The D2PAK is a surface-mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and lowest possible on-resistance
in any existing surface mount package. The D2PAK is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0 W
in a typical surface mount application.
The through-hole version (IRFZ44L, SiHFZ44L) is available
for low profile applications.
Note
a. See device orientation
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V; starting TJ = 25 °C, L = 44 μH, Rg = 25 , IAS = 51 A (see fig. 12)
c. ISD  51 A, dI/dt  250 A/μs, VDD  VDS, TJ  175 °C
d. 1.6 mm from case
e. Calculated continuous current based on maximum allowable junction temperature
f. Uses IRFZ44, SiHFZ44 data and test conditions
PRODUCT SUMMARY
VDS (V)
60
RDS(on) ()VGS = 10 V
0.028
Qg (Max.) (nC)
67
Qgs (nC)
18
Qgd (nC)
25
Configuration
Single
N-Channel MOSFET
G
D
S
D2PAK (TO-263)
G
D
S
I2PAK (TO-262)
G
D
S
Available
Available
ORDERING INFORMATION
Package
D2PAK (TO-263)
D2PAK (TO-263)
D2PAK (TO-263)
I2PAK (TO-262)
Lead (Pb)-free and Halogen-free
SiHFZ44S-GE3
SiHFZ44STRR-GE3a
SiHFZ44STRL-GE3a
SIHFZ44L-GE3
Lead (Pb)-free
IRFZ44SPbF
-
IRFZ44STRLPbFa
IRFZ44LPbF
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltagef
VDS
60
V
Gate-Source Voltagef
VGS
± 20
Continuous Drain Currente
VGS at 10 V
TC = 25 °C
ID
50
A
Continuous Drain Current
TC = 100 °C
36
Pulsed Drain Currenta, e
IDM
200
Linear Derating Factor
1.0
W/°C
Single Pulse Avalanche Energyb
EAS
100
mJ
Maximum Power Dissipation
TA = 25 °C
PD
3.7
W
TC = 25 °C
150
Peak Diode Recovery dV/dtc, f
dV/dt
4.5
V/ns
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 175
°C
Soldering Recommendations (Peak Temperatured)
for 10 s
300


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