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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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SPSB081C3 데이터시트(PDF) 11 Page - STMicroelectronics |
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SPSB081C3 데이터시트(HTML) 11 Page - STMicroelectronics |
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11 / 135 page  • OUT1: Iload = 50 mA; Rdson = 330 Ω (DC activation) • OUT2: Iload = 50 mA; Rdson = 330 Ω (DC activation) • OUT3: Iload = 50 mA; Rdson = 330 Ω (DC activation) • OUT4: Iload = 50 mA; Rdson = 330 Ω (DC activation) • CAN-LIN not relevant Test execution: Once thermal equilibrium is reached with all DC load active, the “Cyclic Activation” sequence is applied. The device operates always without triggering the thermal warning threshold. Figure 5. QFN32L 5x5 4-layers Note: PCB 129 mm x 60 mm x 1.6 mm, FR4, four layers; Cu thickness 0.070 mm (outer layers). Cu thickness 0.035 mm (inner layers), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, footprint dimension 3.5 mm x 3.5 mm. SPSB081 Temperature ranges and thermal data DS14048 - Rev 1 page 11/135 |
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