STA8090EXGA datasheet(29/42 Pages) STMICROELECTRONICS

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DS11733 Rev 3

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STA8090EXGA

Electrical characteristics

Note:

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent

damage to the device. This is a stress rating only and functional operation of the device at

these or any other conditions above those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

VINB

Backup LDO input supply voltage (1.6 V to 4.3 V)

-0.3

4.8

VINL1

LDO1 input supply voltage (1.6 V to 4.3 V)

-0.3

4.8

VINL2

LDO2 input supply voltage (1.6 V to 4.3 V)

-0.3

4.8

VINM

SMPS coil input supply (1.6 V to 4.3 V)

-0.3

4.8

VDD_ANA

SMPS input supply (1.6 V to 4.3 V)

-0.3

4.8

VESD-HBM

Electrostatic discharge, human body model(1)

-2

VESD-CDM

Electrostatic discharge, charge device model(2)

-250

250

1. Balls sustaining only ±500 V are: A1, A2, A9, A10, A11, A12, A13, B1, B2, B13, C1, C2, D1, E1, E2, E10,

E11, F1, N11, N12, N13.

2. Ball N10 (LNA_IN) sustains only ±100 V.

Table 13. Voltage characteristics (continued)

Symbol

Parameter

Min.

Max.

Unit

Table 14. Thermal characteristics

Symbol

Parameter

Min.

Max.

Unit

Toper

Operative temperature range

-40

°C

Operative junction temperature

-40

125

°C

Tst

Storage temperature

-55

150

°C

Rj-amb

Thermal resistance junction to ambient(1)

1. According to JEDEC specification on a 2 layers board.

—41

°C/W

Table 15. Frequency limits

Symbol

Parameter

Test condition

Min.

Typ.

Max.

Unit

FCLK

Operating ARM9 CPU frequency V

DDD =1.2 V;

TC =85 °C(1)

1. Not tested in production.

——

196

MHz

FAHB

AHB frequency

—

MHz

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