Package and packing information

STA8090EXGA

38/42

DS11733 Rev 3

5

Package and packing information

5.1

ECOPACK packages

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

5.2

TFBGA169 9 x 9 x 1.2 mm package information

Table 31. TFBGA169 9 x 9 x 1.2 mm mechanical data

Ref. dim

Dimensions (mm)

Min.

Typ.

Max.

A(1)

1. TFBGA stands for Thin profile Fine Pitch Ball Grid Array.

- The total profile height (Dim A) is measured from the seating plane to the top of the component

- The maximum total package height is calculated by the following methodology:

A Max =A1Typ +A2Typ +A4Typ +

(A12 +A22 +A42 tolerance values)

- Thin profile: 1.00 mm < A

 1.20 mm / Fine pitch: e < 1.00 mm pitch.

1.20

A1(2)

2. - The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized

markings, or other feature of package body or integral heatslug.

- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1

corner. Exact shape of each corner is optional.

0.21

A2

0.20

A4

0.585

b(3)

3. The typical ball diameter before mounting is 0.35 mm.

0.30

0.35

0.40

D

8.85

9.00

9.15

D1

7.80

E

9.85

9.00

9.15

E1

7.80

e0.65

Z0.60

ddd

0.08

eee(4)

4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball

must lie within this tolerance zone.

0.15

fff(5)

0.05