8.6

Handling and storage precautions

8.6.1

Recommended solder pad dimensions

8.6.2

Shock precautions

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject

to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even

if no apparent damage is visible.

8.6.3

Part handling

Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are

susceptible to damage or contamination. The customer is advised to use a clean assembly process until a

protective cover glass is mounted.

8.6.4

Compression force

A maximum compressive load of 25 N should be applied on the module.

8.6.5

Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C.

Note:

If devices are stored out of the packaging for more than 168 hours, the devices should be baked before use. The

optimum bake recommended is at + 90°C for a minimum of 6 hours.

8.7

Storage temperature conditions

Parameter

Min.

Typ.

Max.

Unit

Temperature (storage)

-40

23

90

°C

VL53L7CX

Handling and storage precautions

DS13865 - Rev 3

page 33/40