ISL97672

FN7632 Rev.4.00

Page 4 of 17

Sep 8, 2017

Absolute Maximum Ratings (TA = +25°C)

Thermal Information

VIN, EN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V

FAULT . . . . . . . . . . . . . . . . . . . . . VIN - 8.5V to VIN + 0.3V

VDC, COMP, RSET, PWM, OVP, /FLAG, FSW . . . -0.3V to 5.5V

CH0 - CH5, LX . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 45V

PGND, AGND . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V

Above voltage ratings are all with respect to AGND pin

ESD Rating

Human Body Model (Tested per JESD22-A114E) . . . . . 3kV

Machine Model (Tested per JESD22-A115-A) . . . . . . . 300V

Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . 1kV

Latch Up (Tested per JESD-78B; Class 2, Level A) . . . 100mA

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C

Thermal Resistance (Typical)

JA (°C/W) JC (°C/W)

20 Ld QFN Package (Notes 4, 5, 7) .

40

2.5

Thermal Characterization (Typical)

PSIJT (°C/W)

20 Ld QFN Package (Note 6) . . . . . . . . . . . .

1

Absolute Maximum Junction Temperature . . . . . . . . +150°C

Recommended Max Operating Junction Temperature . +125°C

Storage Temperature . . . . . . . . . . . . . . . -65°C to +150°C

Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . see TB493

IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless

otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact

product reliability and result in failures not covered by warranty.

NOTES:

4. JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach”

features. See TB379.

5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside assumed under ideal case

temperature.

6. PSIJT is the junction-to-top thermal resistance. If the package top temperature can be measured, with this rating then the die

junction temperature can be estimated more accurately than the JC and JC thermal resistance ratings.

7. Refer to JESD51-7 high effective thermal conductivity board layout for proper via and plane designs.

Electrical Specifications All specifications below are tested at TA = +25°C; VIN = 12V, EN = 5V, RSET = 20.52k, unless

otherwise noted. Boldface limits apply over the operating temperature range, -40°C to +85°C.

PARAMETER

DESCRIPTION

CONDITION

MIN

(Note 8)TYP

MAX

(Note 8)UNIT

GENERAL

VIN (Note 9)

Backlight Supply Voltage

TC = <+60°C

TA = +25°C

4.5

26.5

V

IVIN_STBY

VIN Shutdown Current

10

µA

VOUT

Output Voltage

4.5V < VIN 26V,

FSW = 600kHz

45

V

8.55V < VIN 26V,

FSW = 1.2MHz

45

V

4.5V < VIN 8.55V,

FSW =1.2MHz

VIN/0.19

V

Vuvlo

Undervoltage Lock-out Threshold

2.6

3.3

V

Vuvlo_hys

Undervoltage Lock-out Hysteresis

275

mV

ENABLE AND PWM GENERATOR

VIL

Guaranteed Range for PWM Input Low

Voltage

0.8

V

VIH

Guaranteed Range for PWM Input High

Voltage

1.5

VDD

V

FPWM

PWM Input Frequency Range

200

30,000

Hz

tON

Minimum On Time

250

350

ns