Tsi721 Datasheet

3

April 4, 2016

Integrated Device Technology

3.4

Power Supply Sequencing....................................................................................................................................................................... 29

3.4.1

Power-Up Sequencing.............................................................................................................................................................. 29

3.4.2

Power-Down Sequencing......................................................................................................................................................... 29

3.5

DC Operating Characteristics .................................................................................................................................................................. 30

3.6

Decoupling Recommendation.................................................................................................................................................................. 31

3.7

AC Timing Specifications......................................................................................................................................................................... 31

3.7.1

PCIe Differential Receiver Specifications ................................................................................................................................. 31

3.7.2

PCIe Differential Transmitter Specifications ............................................................................................................................. 34

3.7.3

RapidIO SerDes Characteristics............................................................................................................................................... 38

3.7.4

Level I Long Run Transmitter Specifications ............................................................................................................................ 43

3.7.5

Reference Clocks – PCCLKP/N and REFCLKP/N................................................................................................................... 57

3.7.6

JTAG and Test Interface Signal Timings .................................................................................................................................. 59

3.7.7

I2C Interface Signal Timings .................................................................................................................................................... 60

3.7.8

GPIO Interface Signal Timings ................................................................................................................................................. 61

3.7.9

RSTn Signal Timings................................................................................................................................................................ 61

4.

Package Specifications............................................................................................................... 62

4.1

Package Dimensions ............................................................................................................................................................................... 62

4.2

Package Diagrams................................................................................................................................................................................... 63

4.3

Thermal Characteristics........................................................................................................................................................................... 64

4.4

Moisture Sensitivity.................................................................................................................................................................................. 64

5.

Ordering Information................................................................................................................... 65