UPD750004 datasheet(75/86 Pages) RENESAS

75 / 86 page

µPD750004, 750006, 750008, 750004(A), 750006(A), 750008(A)

Data Sheet U10738EJ3V2DS

15. RECOMMENDED SOLDERING CONDITIONS

The

µPD750004, µPD750006, and µPD750008 should be soldered and mounted under the following recommended

conditions.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Table 15-1. Surface Mounting Type Soldering Conditions (1/2)

(1)

µPD750004GB-×××-3BS-MTX:

44-pin plastic QFP (10

× 10 mm, 0.8 mm pitch)

µPD750006GB-×××-3BS-MTX:

44-pin plastic QFP (10

× 10 mm, 0.8 mm pitch)

µPD750008GB-×××-3BS-MTX:

44-pin plastic QFP (10

× 10 mm, 0.8 mm pitch)

µPD750004GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)

µPD750006GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)

µPD750008GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)

Soldering

Soldering Conditions

Recommended

Method

Condition Symbol

Infrared reflow

Package peak temperature: 235˚C, Time: 30 seconds max. (at 210˚C or higher),

IR35-00-3

Count: Three times or less

VPS

Package peak temperature: 215˚C, Time: 40 seconds max. (at 200˚C or higher),

VP15-00-3

Count: Twice or less

Wave soldering

Solder bath temperature: 260˚C max., Time: 10 seconds max., Count: Once

WS60-00-1

Preheating temperature: 120˚C max. (package surface temperature)

Partial heating

Pin temperature: 350˚C max., Time: 3 seconds max. (per pin row)

—

Caution Do not use different soldering methods together (except for partial heating).

Remark

For soldering methods and conditions other than those recommended above, contact an NEC Electronics

sales representative.

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