| 전자부품 데이터시트 검색엔진 |
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DIM2400ESS12 데이터시트(PDF) 5 Page - Dynex Semiconductor |
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DIM2400ESS12 데이터시트(HTML) 5 Page - Dynex Semiconductor |
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5 / 9 page ![]() SEMICONDUCTOR DIM2400ESS12-A000 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 5/9 www.dynexsemi.com ELECTRICAL CHARACTERISTICS Tcase = 25° C unless stated otherwise. Symbol Parameter Test Conditions Min. Typ. Max. Units td(off) Turn-off delay time IC = 2400A - 1370 - ns tf Fall time VGE = ±15V - 230 - ns EOFF Turn-off energy loss VCE = 600V - 520 - mJ td(on) Turn-on delay time RG(ON) = RG(OFF) = 1 Ω - 250 - ns tr Rise time L ∼ 50nH - 230 - ns EON Turn-on energy loss - 180 - mJ Qg Gate charge - 26 - µC Qrr Diode reverse recovery charge IF = 2400A, VR = 600V, - 310 - µC Irr Diode reverse current dlF/dt = 9500A/µs - 1000 - A EREC Diode reverse recovery energy - 150 - mJ Tcase = 125° C unless stated otherwise. Symbol Parameter Test Conditions Min. Typ. Max. Units td(off) Turn-off delay time IC = 2400A - 1570 - ns tf Fall time VGE = ±15V - 230 - ns EOFF Turn-off energy loss VCE = 600V - 600 - mJ td(on) Turn-on delay time RG(ON) = RG(OFF) = 1 Ω - 360 - ns tr Rise time L ∼ 50nH - 290 - ns EON Turn-on energy loss - 200 - mJ Qrr Diode reverse recovery charge IF = 2400A, VR = 600V, - 540 - µC Irr Diode reverse current dlF/dt = 8500A/µs - 1260 - A EREC Diode reverse recovery energy - 260 - mJ |
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