MCP6G01-ESLASHMS datasheet(13/38 Pages) MICROCHIP

13 / 38 page

DS22004B-page 13

MCP6G01/1R/1U/2/3/4

Note: Unless otherwise indicated, TA =+25°C, VDD = +1.8V to +5.5V, VSS = GND, G = +1 V/V, VIN = (0.3V)/G,

RL =100 kΩ to VDD/2, CL = 60 pF, GSEL = VDD/2, and CS is tied low.

FIGURE 2-25:

Slew Rate vs. Temperature,

with G = +1.

FIGURE 2-26:

Slew Rate vs. Temperature,

with G = +10.

FIGURE 2-27:

Bandwidth vs. Resistive

Load.

FIGURE 2-28:

Output Voltage Swing vs.

Frequency.

FIGURE 2-29:

Slew Rate vs. Temperature,

with G = +50.

FIGURE 2-30:

Bandwidth vs. Capacitive

Load.

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

-50

-25

100

125

Ambient Temperature (°C)

G = +1 V/V

Falling Edge

Rising Edge

VDD = 1.8V

VDD = 5.5V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-50

-25

100

125

Ambient Temperature (°C)

G = +10 V/V

Falling Edge

Rising Edge

VDD = 5.5V

1.E+04

1.E+05

1.E+06

1.E+02

1.E+03

1.E+04

1.E+05

Resistive Load ( )

G = +1

G = +10

G = +50

10k

100k

10k

100k

100

0.1

1.E+03

1.E+04

1.E+05

1.E+06

Frequency (Hz)

VDD = 1.8V

VDD = 5.5V

G = +1

G = +10

G = +50

100k

10k

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

-50

-25

100

125

Ambient Temperature (°C)

G = +50 V/V

Falling Edge

Rising Edge

VDD = 5.5V

1.E+05

1.E+06

100

1000

Capacitive Load (pF)

100k

G = +10

G = +50

G = +1

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