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STW81100

11 Package Information

packages have a Lead-free second level interconnect. The category of second Level Interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark.

ECOPACK specifications are available at: http://www.st.com.

Figure 32. VFQFPN28 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

REF.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

0.800

0.900

1.000

0.031

0.035

0.039

A1

0.020

0.050

0.0008 0.0019

A2

0.650

1.000

0.025

0.039

A3

0.200

0.0078

b

0.180

0.250

0.300

0.007 0.0098 0.012

D

4.850

5.000

5.150

0.191

0.197

0.203

D1

4.750

0.187

D2

1.250

2.700

3.250

0.049

0.106

0.128

E

4.850

5.000

5.150

0.191

0.197

0.203

E1

4.750

0.187

E2

1.250

2.700

3.250

0.049

0.106

0.128

e

0.500

0.020

L

0.350

0.550

0.750

0.014

0.022

0.029

P

0.60

0.0236

K

14˚

14˚

ddd

0.080

0.003

Notes: 1) VFQFPN stands for Thermally Enhanced Very thin Fine

pitch Quad Packages No lead.

Very thin: A = 1.00 Max.

2) The pin #1 identifier must be existed on the top surface

of the package by using indentation mark or other fea-

ture of package body.

Exact shape and size of this feature is optional.

VFQFPN-28 (5x5x1.0mm)

Very Fine Quad Flat Package No lead

7655832 A