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DIX4192IPFB 데이터시트(PDF) 2 Page - Texas Instruments

부품명 DIX4192IPFB
상세설명  DIX4192 Integrated Digital Audio Interface Receiver and Transmitter
PDF  71 Pages
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제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments

DIX4192IPFB 데이터시트(HTML) 2 Page - Texas Instruments

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DIX4192
SBFS031F – FEBRUARY 2006 – REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: DIX4192
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Description (continued)......................................... 3
6
Device Comparison Table..................................... 3
7
Pin Configuration and Functions ......................... 4
8
Specifications......................................................... 5
8.1
Absolute Maximum Ratings ...................................... 5
8.2
ESD Ratings.............................................................. 6
8.3
Recommended Operating Conditions ....................... 6
8.4
Thermal Information .................................................. 6
8.5
Electrical Characteristics........................................... 6
8.6
Timing Requirements ................................................ 7
8.7
Typical Characteristics ............................................ 10
9
Detailed Description ............................................ 11
9.1
Overview ................................................................. 11
9.2
Functional Block Diagram ....................................... 12
9.3
Feature Description................................................. 12
9.4
Device Functional Modes........................................ 23
9.5
Register Maps ........................................................ 26
10
Application and Implementation........................ 51
10.1
Application Information.......................................... 51
10.2
Typical Application ................................................ 58
11
Power Supply Recommendations ..................... 59
12
Layout................................................................... 60
12.1
Layout Guidelines ................................................. 60
12.2
Layout Example .................................................... 60
13
Device and Documentation Support ................. 61
13.1
Device Support...................................................... 61
13.2
Documentation Support ........................................ 61
13.3
Receiving Notification of Documentation Updates 61
13.4
Community Resources.......................................... 61
13.5
Trademarks ........................................................... 61
13.6
Electrostatic Discharge Caution ............................ 62
13.7
Glossary ................................................................ 62
14
Mechanical, Packaging, and Orderable
Information ........................................................... 62
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (April 2016) to Revision F
Page
•
Changed fMCLK Max value From: 2.27 To: 27.7 ..................................................................................................................... 6
Changes from Revision D (January 2016) to Revision E
Page
•
Changed "IIH High-level input current" MAX value From: 10 µA To: 25 µA in the Electrical Characteristics table ................ 6
•
Changed Byte 2 in Figure 22a) Current Address Read, .. .................................................................................................. 25
Changes from Revision C (June 2006) to Revision D
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section. .............................................................. 1



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