HCF1305-2R2-R datasheet(23/39 Pages) MICROCHIP

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DS20007043B-page 23

MIC24054

5.6

Thermal Measurements

Measuring the IC’s case temperature is recommended

to ensure it is within its operating limits. Although this

might seem like a very elementary task, it is easy to get

erroneous results. The most common mistake is to use

the standard thermal couple that comes with a thermal

meter. This thermal couple wire gauge is large, typically

22 gauge, and behaves like a heatsink, resulting in a

lower case measurement.

Two methods of temperature measurement are using a

smaller thermal couple wire or an infrared

thermometer. If a thermal couple wire is used, then it

must be constructed of 36 gauge wire or higher then

(smaller wire size) to minimize the wire heat-sinking

effect. In addition, the thermal couple tip must be

covered in either thermal grease or thermal glue to

make sure that the thermal couple junction is making

good contact with the case of the IC. Omega brand

thermal couple (5SC-TT-K-36-36) is adequate for most

applications.

Wherever possible, an infrared thermometer is

recommended. The measurement spot size of most

infrared thermometers is too large for an accurate

reading on a small form factor ICs. However, a IR

thermometer from Optris has a 1 mm spot size, which

makes it a good choice for measuring the hottest point

on the case. An optional stand makes it easy to hold the

beam on the IC for long periods of time.

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