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2025-2026 Microchip Technology Inc. and its subsidiaries

DS20007043B-page 33

MIC24054

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Length

Contact Pitch

Y2

MILLIMETERS

0.65 BSC

MIN

E

MAX

NOM

1

2

28

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

C1

C2

EV

X2

EV

Y2

Y3

G2

Y1

G1

G3

G4

G5

X3

X4

X1

G6

Center Pad Width

X2

3.70

Center Pad Width

X3

2.20

Center Pad Width

X4

0.90

1.60

2.83

Dimension Limits

Units

C2

Contact Pad Spacing

MILLIMETERS

MIN

MAX

5.80

Contact Pad Length

Contact Pad Width

Y1

X1

0.40

0.30

NOM

C1

Contact Pad Spacing

4.80

Contact Pad to Contact Pad

G2

0.35

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

Contact Pad to Center Pad

G1

0.12

Center Pad Length

Y3

ØV

E

Contact Pad to Center Pad

G4

0.60

Center Pad to Center Pad

G3

0.35

Center Pad to Center Pad

G5

0.13

Contact Pad to Center Pad

G6

0.35

SILK SCREEN

28-Lead Very Thin Plastic Quad Flat, No Lead Package (PKA) - 5x6x0.9 mm Body [VQFN]

With Multiple Exposed Pads and Fused Terminals; Micrel Legacy QFN56-28LD-PL-1

Microchip Technology Drawing C04-3120 Rev A