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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PAC1721 데이터시트(PDF) 85 Page - Microchip Technology |
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PAC1721 데이터시트(HTML) 85 Page - Microchip Technology |
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85 / 92 page  2026 Microchip Technology Inc. and its subsidiaries DS-20007088A-page 85 PAC1721 RECOMMENDED LAND PATTERN Dimension Limits Units Center Pad Width (X4) Center Pad Length (X4) Contact Pitch Y2 X2 0.35 0.55 MILLIMETERS 0.65 BSC MIN E MAX Contact Pad Length (X8) Contact Pad Width (X8) Y1 X1 0.90 0.35 NOM C Contact Pad Spacing 2.80 Center Pad to Center Pad G4 0.21 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Center Pad to Center Pad G3 0.43 Microchip Technology Drawing C04-2568 Rev B C Contact Pad to Contact Pad (X6) G2 0.30 Contact Pad to Center Pad (X8) G1 0.50 E X1 Y1 Y2 X2 G1 G4 G3 G2 SILK SCREEN 8-Lead Very Thin Plastic Dual Flat, No Lead Package (3PW) - 3x3x1.0 mm Body [VDFN] With Multiple Exposed Pad and Stepped Wettable Flanks |
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