AT45DB021D_09 datasheet(53/54 Pages) ATMEL

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3638I–DFLASH–04/09

AT45DB021D

28. Revision History

Revision Level – Release Date

History

A – June 2006

Initial release.

B – February 2007

Removed RDY/BUSY pin references.

C – August 2007

Changed tVCSL time to 1 ms.

Changed IDP (Max) to 15 µA.

Added Chip Erase time.

Changed tRDPD time to 35 µs.

Fixed the typographical error in the Block Architecture diagram.

D – November 2007

Changed the tXFR and tCOMP times from 400 µs to 200 µs.

Changed part number ordering code to reflect NiPdAu lead finish.

- Changed AT45DB021D-MU to AT45DB021D-MH.

- Changed AT45DB021D-SSU to AT45DB021D-SSH.

- Changed AT45DB021D-SU to AT45DB021D-SH.

Added lead finish details to Ordering Information table.

Added Ordering Code Detail.

E – February 2008

Fixed the typographical error, under Status Register Read, to

indicate that bit 3 is a “0”.

F – April 2008

Replaced 8M1-A MLF Package with 8MA1 UDFN Package.

Added part number ordering code details for suffixes SL954/955.

G – February 2009

Changed tDIS (Typ and Max) to 27 ns and 35 ns, respectively.

H – March 2009

Changed Deep Power-Down Current values

- Increased typical value from 5 µA to 15 µA.

- Increased maximum value from 15 µA to 25 µA.

I - April 2009

Updated Absolute Maximum Ratings

Updated System Specifications

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