AS3525 datasheet(172/194 Pages) AMSCO

172 / 194 page

AS3525-A/-B C22O22

Data Sheet, Confidential

www.austriamicrosystems.com

Revision 1.13

172

- 194

Pinout and Packaging

8.1

Package Variants

CTBGA (Thin ChipArray BGA) package technology is used for multi-chip-module (MCM) packaging. The following package variants are

available for the product:

Table 160 Package Options

Product

Code

Package

Balls

Ball Matrix

Pitch

[mm]

Height

[mm]

Size

[mm]

Application

AS3525-A

CTBGA

224

15x15, 7 Row

0.8

1.2

13x13

with external SDRAM interface

AS3525-B

CTBGA

144

12x12, full

0.8

1.2

10x10

w/o external SDRAM interface

8.2

CTBGA224 Package Drawings

8.2.1 Marking

Figure 60 CTBGA224 Package Marking

AS3525A

C22O22

AYWWZZZ

Package Code AYYWWZZZ

ZZZ

A … for PB free

Year

working week assembly/packaging

Free choice

Figure 61 CTBGA224 Package Drawing

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