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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MC68HC705P9CS 데이터시트(PDF) 140 Page - Freescale Semiconductor, Inc |
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MC68HC705P9CS 데이터시트(HTML) 140 Page - Freescale Semiconductor, Inc |
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140 / 160 page  Electrical Specifications Technical Data MC68HC705P9 — Rev. 4.0 140 Electrical Specifications MOTOROLA 12.5 Power Considerations The average chip junction temperature, TJ, in °C can be obtained from: TJ = TA + (PD x θJA)(1) Where: TA = ambient temperature in °C θ JA = package thermal resistance, junction to ambient in °C/W PD = PINT + PI/O PINT = ICC × VCC = chip internal power dissipation PI/O = power dissipation on input and output pins (user-determined) For most applications, PI/O < PINT and can be neglected. Ignoring PI/O, the relationship between PD and TJ is approximately: (2) Solving equations (1) and (2) for K gives: K = PD x (TA + 273°C) + θJA x (PD) 2 (3) where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA. PD = TJ + 273°C K Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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