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Thermal Specifications and Design Considerations

Datasheet

The case temperature is defined at the geometric top center of the processor. Analysis

indicates that real applications are unlikely to cause the processor to consume

maximum power dissipation for sustained time periods. Intel recommends that

complete thermal solution designs target the Thermal Design Power (TDP) indicated in

Table 26 instead of the maximum processor power consumption. The Thermal Monitor

feature is designed to protect the processor in the unlikely event that an application

exceeds the TDP recommendation for a sustained periods of time. For more details on

the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor

Feature must be enabled for the processor to remain within specification.

Table 26.

Processor Thermal Specifications for 775_VR_CONFIG_05A Processors

Processor

Number

Core Frequency

(GHz)

Thermal

Design

Power (W)

Minimum

TC (°C)

Maximum TC (°C)

Notes

356

3.33

See Table 28 and

Figure 12

1, 2

NOTES:

1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the

maximum power that the processor can dissipate.

2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.

Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile

figure and associated table for the allowed combinations of power and TC.

352

3.2

1, 2

347

3.06

1, 2

Table 27.

Processor Thermal Specifications for 775_VR_CONFIG_06 Processors

Processor

Number

Core Frequency

(GHz)

Thermal

Design

Power (W)

Minimum

TC (°C)

Maximum TC (°C)

Notes

365

3.66

See Table 29 and

Figure 13

1, 2

360

3.46

1, 2

356

3.33

1, 2

352

3.2

1, 2

347

3.06

1, 2

NOTES:

Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power

that the processor can dissipate.

This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the max-

imum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the

allowed combinations of power and TC.

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