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Datasheet

Boxed Processor Specifications

The Celeron D processor will also be offered as an Intel boxed processor. Intel boxed

processors are intended for system integrators who build systems from baseboards and

standard components. The Boxed Celeron D processor will be supplied with a cooling

solution. This chapter documents baseboard and system requirements for the cooling

solution that will be supplied with the boxed Celeron D processor. This chapter is

particularly important for OEMs that manufacture baseboards for system integrators.

Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and

inches [in brackets]. Figure 16 shows a mechanical representation of a boxed Celeron

D processor.

Note:

• Drawings in this section reflect only the specifications on the Intel boxed processor

product. These dimensions should not be used as a generic keep-out zone for all

cooling solutions. It is the system designers’ responsibility to consider their

proprietary cooling solution when designing to the required keep-out zone on their

system platforms and chassis. Refer to the appropriate processor Thermal and

Mechanical Design Guidelines (see Section 1.2) for further guidance. Contact your

local Intel Sales Representative for this document.

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

7.1

Mechanical Specifications

7.1.1

Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed Celeron D processor.

The boxed processor will be shipped with an unattached fan heatsink. Figure 16 shows

a mechanical representation of the boxed Celeron D processor.

Figure 16.

Mechanical Representation of the Boxed Processor

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