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STM32F103CBU6TR 데이터시트(PDF) 78 Page - STMicroelectronics

부품명 STM32F103CBU6TR
상세설명  Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces
PDF  96 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103CBU6TR 데이터시트(HTML) 78 Page - STMicroelectronics

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Package characteristics
STM32F103x8, STM32F103xB
78/96
Doc ID 13587 Rev 12
1.
Drawing is not to scale.
2.
The back-side pad is not internally connected to the VSS or VDD power pads.
3.
There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
also be soldered to the PCB. It is recommended to connect it to VSS.
Figure 42.
VFQFPN48 7 x 7 mm, 0.5 mm pitch, package
outline(1)
Figure 43.
Recommended footprint
(dimensions in mm)(1)(2)(3)
Seating
Plane
C
Pin no. 1 ID
R = 0.20
Bottom View
1
48
L
12
13
D2
b
24
25
36
37
e
D
V0_ME
0.50
7.30
0.75
5.80
5.80
6.20
6.20
5.60
5.60
13
1
24
37
ai15799
12
48
36
25
0.55
0.30
0.20
Table 51.
VFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.800
0.900
1.000
0.0315
0.0354
0.0394
A1
0.020
0.050
0.0008
0.0020
A2
0.650
1.000
0.0256
0.0394
A3
0.250
0.0098
b
0.180
0.230
0.300
0.0071
0.0091
0.0118
D
6.850
7.000
7.150
0.2697
0.2756
0.2815
D2
2.250
4.700
5.250
0.0886
0.1850
0.2067
E
6.850
7.000
7.150
0.2697
0.2756
0.2815
E2
2.250
4.700
5.250
0.0886
0.1850
0.2067
e
0.450
0.500
0.550
0.0177
0.0197
0.0217
L
0.300
0.400
0.500
0.0118
0.0157
0.0197
ddd
0.080
0.0031
1.
Values in inches are converted from mm and rounded to 4 decimal digits.



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