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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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IMX53CEC 데이터시트(PDF) 175 Page - Freescale Semiconductor, Inc |
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IMX53CEC 데이터시트(HTML) 175 Page - Freescale Semiconductor, Inc |
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175 / 204 page  Package Information and Contact Assignments i.MX53xD Applications Processors for Consumer Products, Rev. 2 Freescale Semiconductor 175 Figure 103. 12 x 12 mm PoP, Side View The following notes apply to Figure 101, Figure 102, and Figure 103. 1 All dimensions are in millimeters. 2 Dimensions and tolerancing per ASME Y14.5M–1994. 3 Terminal position designation per JESD 95-1, SPP-010 4 Compliant to JESD 95-1 design guide 4.22, no exact variation, and with exception to dimension ‘A’ 5 Raw solder ball size during assembly is 0.25mm 6.3.2 12x 12 PoP Signal Assignments, Power Rails, and I/O Table 114 and Table 115 show the device connection list for ground, power, sense, and reference contact signals. Table 118 displays an alpha-sorted list of the signal assignments including associated power supplies. The table also includes out of reset pad state. Table 119 and Table 120 show the package ball maps. |
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