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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LPC4350 데이터시트(PDF) 133 Page - NXP Semiconductors |
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LPC4350 데이터시트(HTML) 133 Page - NXP Semiconductors |
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133 / 145 page  LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 133 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 15. Soldering Fig 48. Reflow soldering of the LBGA256 package DIMENSIONS in mm PSL SP SR Hx Hy Hx Hy SOT740-2 solder land plus solder paste occupied area Footprint information for reflow soldering of LBGA256 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot740-2_fr 1.00 0.450 0.450 0.600 17.500 17.500 |
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