AFS090 datasheet(224/334 Pages) MICROSEMI

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Device Architecture

2- 20 8

R e v isio n 2

SSTL2 Class II

Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). Fusion devices support Class

II. This provides a differential amplifier input buffer and a push-pull output buffer.

Timing Characteristics

Table 2-159 • Minimum and Maximum DC Input and Output Levels

SSTL2 Class II

VIL

VIH

VOL

VOH

IOL IOH IOSL

IOSH

IIL1 IIH2

Drive Strength

Min.

Max.

Min.

Max.

Min.

VmA mA

Max.

mA3

Max.

mA3

µA4 µA4

18 mA

–0.3 VREF – 0.2 VREF + 0.2

3.6

0.35 VCCI – 0.43 18

124

169

Notes:

1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.

2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is

larger when operating outside recommended ranges.

3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

4. Currents are measured at 85°C junction temperature.

Figure 2-129 • AC Loading

Table 2-160 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V)

Input High (V)

Measuring Point* (V)

VREF (typ.) (V)

VTT (typ.) (V)

CLOAD (pF)

VREF – 0.2

VREF + 0.2

1.25

Note:

*Measuring point = Vtrip. See Table 2-90 on page 2-168 for a complete table of trip points.

Test Point

30 pF

SSTL2

Class II

VTT

Table 2-161 • SSTL 2 Class II

Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 2.3 V, VREF = 1.25 V

Speed

Grade

tDOUT

tDP

tDIN

tPY

tEOUT

tZL

tZH

tLZ

tHZ

tZLS

tZHS

Units

Std.

0.66

2.17

0.04

1.33

0.43

2.21

1.77

4.44

4.01

–1

0.56

1.84

0.04

1.14

0.36

1.88

1.51

3.78

3.41

–2

0.49

1.62

0.03

1.00

0.32

1.65

1.32

3.32

2.99

Note:

For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on

page 3-9.

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