S29GL01GP datasheet(14/81 Pages) SPANSION

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S29GL-P MirrorBit® Flash Family

S29GL-P_00_A14 October 22, 2012

Da ta

Sh e e t

4.3

LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm

Figure 4.2 LAA064—64ball Fortified Ball Grid Array (FBGA), 11 x 13 mm

3354 \ 16-038.12d

PACKAGE

LAA 064

JEDEC

N/A

13.00 mm x 11.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

---

1.40

PROFILE HEIGHT

0.40

---

STANDOFF

0.60

---

BODY THICKNESS

13.00 BSC.

BODY SIZE

11.00 BSC.

BODY SIZE

7.00 BSC.

MATRIX FOOTPRINT

7.00 BSC.

MATRIX FOOTPRINT

MATRIX SIZE D DIRECTION

MATRIX SIZE E DIRECTION

BALL COUNT

φb

0.50

0.60

0.70

BALL DIAMETER

1.00 BSC.

BALL PITCH - D DIRECTION

1.00 BSC.

BALL PITCH - E DIRECTION

SD / SE

0.50 BSC.

SOLDER BALL PLACEMENT

NONE

DEPOPULATED SOLDER BALLS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT

AS NOTED).

e REPRESENTS THE SOLDER BALL GRID PITCH.

5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE

"D" DIRECTION.

SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE

"E" DIRECTION.

N IS THE TOTAL NUMBER OF SOLDER BALLS.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS

A AND B AND DEFINE THE POSITION OF THE CENTER

SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN

THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,

RESPECTIVELY, SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN

THE OUTER ROW, SD OR SE = e/2

8. NOT USED.

9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

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