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LM5017MRX_NOPB 데이터시트(PDF) 3 Page - Texas Instruments |
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LM5017MRX_NOPB 데이터시트(HTML) 3 Page - Texas Instruments |
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3 / 19 page ![]() LM5017 www.ti.com SNVS783D – JANUARY 2012 – REVISED MAY 2013 Absolute Maximum Ratings (1) (2) VIN, UVLO to RTN -0.3V to 100V SW to RTN -1.5V to VIN +0.3V BST to VCC 100V BST to SW 13V RON to RTN -0.3V to 100V VCC to RTN -0.3V to 13V FB to RTN -0.3V to 5V ESD Rating (Human Body Model(3) 2kV Lead Temperature (4) 200°C Storage Temperature Range -55°C to +150°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics. The RTN pin is the GND reference electrically connected to the substrate. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) The human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. (4) For detailed information on soldering plastic SO PowerPAD package, refer to the SNOA549 available from Texas Instruments. Max solder time not to exceed 4 seconds. Operating Ratings (1) VIN Voltage 9V to 100V Operating Junction Temperature −40°C to +125°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics. The RTN pin is the GND reference electrically connected to the substrate. Thermal Characteristics (1) WSON-8 SO PowerPAD-8 UNIT θJA Junction-to-ambient thermal resistance 41.3 41.1 °C/W θJCbot Junction-to-case (bottom) thermal resistance 3.2 2.4 °C/W ΨJB Junction-to-board thermal characteristic parameter 19.2 24.4 °C/W θJB Junction-to-board thermal resistance 19.1 30.6 °C/W θJCtop Junction-to-case (top) thermal resistance 34.7 37.3 °C/W ΨJT Junction-to-top thermal characteristic parameter 0.3 6.7 °C/W (1) The package thermal impedance is calculated in accordance with JESD 51. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM5017 |
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