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LM5017MRX_NOPB 데이터시트(PDF) 3 Page - Texas Instruments

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부품명 LM5017MRX_NOPB
상세설명  600mA Constant On-Time Synchronous Buck Regulator
PDF  19 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

LM5017MRX_NOPB 데이터시트(HTML) 3 Page - Texas Instruments

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LM5017
www.ti.com
SNVS783D – JANUARY 2012 – REVISED MAY 2013
Absolute Maximum Ratings
(1) (2)
VIN, UVLO to RTN
-0.3V to 100V
SW to RTN
-1.5V to VIN +0.3V
BST to VCC
100V
BST to SW
13V
RON to RTN
-0.3V to 100V
VCC to RTN
-0.3V to 13V
FB to RTN
-0.3V to 5V
ESD Rating (Human Body Model(3)
2kV
Lead Temperature (4)
200°C
Storage Temperature Range
-55°C to +150°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
The RTN pin is the GND reference electrically connected to the substrate.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
The human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin.
(4)
For detailed information on soldering plastic SO PowerPAD package, refer to the SNOA549 available from Texas Instruments. Max
solder time not to exceed 4 seconds.
Operating Ratings
(1)
VIN Voltage
9V to 100V
Operating Junction Temperature
−40°C to +125°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
The RTN pin is the GND reference electrically connected to the substrate.
Thermal Characteristics
(1)
WSON-8
SO PowerPAD-8
UNIT
θJA
Junction-to-ambient thermal resistance
41.3
41.1
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance
3.2
2.4
°C/W
ΨJB
Junction-to-board thermal characteristic parameter
19.2
24.4
°C/W
θJB
Junction-to-board thermal resistance
19.1
30.6
°C/W
θJCtop
Junction-to-case (top) thermal resistance
34.7
37.3
°C/W
ΨJT
Junction-to-top thermal characteristic parameter
0.3
6.7
°C/W
(1)
The package thermal impedance is calculated in accordance with JESD 51.
Copyright © 2012–2013, Texas Instruments Incorporated
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Product Folder Links: LM5017



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