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GD82541PI 데이터시트(PDF) 33 Page - Intel Corporation |
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GD82541PI 데이터시트(HTML) 33 Page - Intel Corporation |
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33 / 46 page ![]() Networking Silicon — 82541(PI/GI/EI) 33 5.0 Package and Pinout Information This section describes the 82541(PI/GI/EI) device physical characteristics. The pin number-to- signal mapping is indicated beginning with Table 14. 5.1 Package Information The 82541(PI/GI/EI) device is a 196-lead plastic ball grid array (BGA) measuring 15 mm by 15 mm. The package dimensions are detailed below. The nominal ball pitch is 1 mm. Figure 11. 82541(PI/GI/EI) Mechanical Specifications Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change. 0.32 +/-0.04 0.40 +/-0.10 Seating Plate 0.85 1.56 +/-0.19 30 o |
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