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W25Q32FVZPIP 데이터시트(PDF) 63 Page - Winbond |
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W25Q32FVZPIP 데이터시트(HTML) 63 Page - Winbond |
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63 / 99 page ![]() W25Q32FV Publication Release Date: Sept 16,, 2013 - 62 - Revision H 8.2.25 Read Manufacturer / Device ID (90h) The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID. The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in Figure 39. The Device ID values for the W25Q32FV are listed in Manufacturer and Device Identification table. The instruction is completed by driving /CS high. /CS CLK DI (IO 0) DO (IO 1) Mode 0 Mode 3 0 1 2 3 4 5 6 7 Instruction (90h) High Impedance 8 9 10 28 29 30 31 Address (000000h) 23 22 21 3 2 1 0 Device ID * /CS CLK DI (IO 0) DO (IO 1) 32 33 34 35 36 37 38 39 Manufacturer ID (EFh) 40 41 42 44 45 46 7 6 5 4 3 2 1 0 * 43 31 0 Mode 0 Mode 3 = MSB * Figure 39. Read Manufacturer / Device ID Instruction (SPI Mode) |
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