| 전자부품 데이터시트 검색엔진 |
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W25Q32FVZPIP 데이터시트(PDF) 94 Page - Winbond |
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W25Q32FVZPIP 데이터시트(HTML) 94 Page - Winbond |
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94 / 99 page ![]() W25Q32FV - 93 - 10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) Symbol Millimeters Inches Min Nom Max Min Nom Max A --- --- 1.20 --- --- 0.047 A1 0.25 0.30 0.35 0.010 0.012 0.014 A2 --- 0.85 --- --- 0.033 --- b 0.35 0.40 0.45 0.014 0.016 0.018 D 7.90 8.00 8.10 0.311 0.315 0.319 D1 4.00 BSC 0.157 BSC E 5.90 6.00 6.10 0.232 0.236 0.240 E1 4.00 BSC 0.157 BSC SE 1.00 TYP 0.039 TYP SD 1.00 TYP 0.039 TYP e 1.00 BSC 0.039 BSC Note: Ball land: 0.45mm. Ball Opening: 0.35mm PCB ball land suggested <= 0.35mm |
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