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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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W25Q32FVZPIP 데이터시트(PDF) 96 Page - Winbond |
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W25Q32FVZPIP 데이터시트(HTML) 96 Page - Winbond |
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96 / 99 page  W25Q32FV - 95 - 11. ORDERING INFORMATION Notes: 1.The “W” prefix is not included on the part marking. 2.Only the 2 nd letter is used for the part marking; WSON package type ZP & ZE are not used for the part marking. 3.Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T) or Tray (shape S), when placing orders. 4.For shipments with OTP feature enabled, please specify when placing orders. W(1) 25Q 32F V xx(2) I W = Winbond 25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O 32F = 32M-bit V = 2.7V to 3.6V SS = 8-pin SOIC 208-mil ST = 8-pin VSOP 208-mil SF = 16-pin SOIC 300-mil DA = 8-pin PDIP 300-mil ZP = WSON8 6x5-mm ZE = WSON8 8x6-mm TB = TFBGA 8x6-mm (5x5-1 ball array) TC = TFBGA 8x6-mm (6x4 ball array) I = Industrial (-40°C to +85°C) (3,4) G = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3) F = Green Package with Fast Sector Erase time (tSE) P = Green Package with Status Register Power-Down & OTP enabled Q = Green Package with QE=1 in Status Register-2 |
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