POWERSTEP01 datasheet(86/92 Pages) STMICROELECTRONICS

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powerSTEP01

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DocID025022 Rev 5

Table 80. VFQFPN 11 x 14 x 1.0 - 9 die pads - 89 leads(1), (2), (3), (4), (5)

1. The pin #1 identifier must exist on the top surface of the package by using indentation mark or other

feature of package body. Exact shape and size of this feature is optional.

2. Dimensioning and tolerances conform to ASME Y14.5-2009.

3. All dimensions are in millimeters.

4. The location of the marked terminal #1 identifier is within the hatched area.

Coplanarity applies to the terminals and all other bottom surface metalization.

Symbol

Dimensions (mm)

Note

Min.

Typ.

Max.

0.80

0.90

1.00

(6)

6. VFQFPN stands for “Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead”.

Very thin: 0.80 mm < A·1.00 mm / fine pitch: e < 1.00 mm.

0.00

0.02

0.05

---

0.20 ref.

---

0.15

0.2

0.25

(7)

7. Dimension b applies to the metalized terminal and is measured between 0.15 mm and 0.30 mm from the

terminal tip. If the terminal has a radius on the other end of it, dimension b should not be measured in that

radius area.

10.90

11.00

11.10

13.90

14.00

14.10

2.00

2.15

2.25

2.70

2.85

2.95

5.35

5.50

5.60

4.54

4.69

4.79

2.17

2.32

2.42

2.88

3.03

3.13

1.01

1.16

1.26

0.54

0.69

0.79

0.3

0.4

0.5

aaa

0.10

bbb

0.10

ccc

0.10

ddd

0.05

eee

0.08

(8)

8. N is the total number of terminals.

LF part no.

443448

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