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RF430CL331HIPWR 데이터시트(PDF) 7 Page - Texas Instruments

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부품명 RF430CL331HIPWR
상세설명  NFC Type 4B Dynamic Dual Interface Transponder
PDF  60 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

RF430CL331HIPWR 데이터시트(HTML) 7 Page - Texas Instruments

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RF430CL331H
www.ti.com
SLASE18A – SEPTEMBER 2015 – REVISED NOVEMBER 2015
4
Specifications
4.1
Absolute Maximum Ratings
(1) (2)
MIN
MAX
UNIT
Voltage applied at VCC referenced to VSS (VAMR)
–0.3
4.1
V
Voltage applied at VANT referenced to VSS (VAMR)
–0.3
4.1
V
Voltage applied to any pin (references to VSS)
–0.3
VCC + 0.3
V
Diode current at any device pin
±2
mA
Storage temperature, Tstg
(3)
–40
125
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are referenced to VSS.
(3)
For soldering during board manufacturing, it is required to follow the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
4.2
ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
4.3
Recommended Operating Conditions
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
NOM
MAX
UNIT
During program execution no RF field present
3.0
3.3
3.6
VCC
Supply voltage
V
During program execution with RF field present
2.0
3.3
3.6
VSS
Supply voltage (GND reference)
0
V
TA
Operating free-air temperature
–40
85
°C
C1
Decoupling capacitor on VCC
(1)
0.1
µF
C2
Decoupling capacitor on VCC
(1)
1
µF
CVCORE
Capacitor on VCORE
(1)
0.1
0.47
1
µF
(1)
Low ESR (equivalent series resistance) capacitor
4.4
Recommended Operating Conditions, Resonant Circuit
MIN
NOM
MAX
UNIT
fc
Carrier frequency
13.56
MHz
VANT_peak Antenna input voltage
3.6
V
Z
Impedance of LC circuit
6.5
15.5
k
Ω
LRES
Coil inductance(1)
2.66
µH
CRES
Total resonance capacitance(1), CRES = CIN + CTune
51.8
pF
CTune
External resonance capacitance
CRES – CIN
(2)
pF
QT
Tank quality factor
30
(1)
The coil inductance of the antenna LRES with the external capacitance CTune plus the device internal capacitance CIN is a resonant
circuit. The resonant frequency of this LC circuit must be close to the carrier frequency fc:
fRES = 1 / [2π(LRESCRES)
1/2] = 1 / [2π(L
RES(CIN+CTune))
1/2] ≈ f
c
(2)
For CIN refer to Section 4.9.3.
Copyright © 2015, Texas Instruments Incorporated
Specifications
7
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Product Folder Links: RF430CL331H



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