MB95F613H datasheet(18/110 Pages) CYPRESS

18 / 110 page

Document Number: 002-04698 Rev. *A

Page 18 of 110

PRELIMINARY

MB95610H Series

■ Latch-up

Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally

high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of

several hundred mA to flow continuously at the power supply pin. This condition is called latch-up.

The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high

heat, smoke or flame. To prevent this from happening, do the following:

(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should

include attention to abnormal noise, surge levels, etc.

(2) Be sure that abnormal current flows do not occur during the power-on sequence.

■ Observance of Safety Regulations and Standards

Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference,

etc. Customers are requested to observe applicable regulations and standards in the design of products.

■ Fail-Safe Design

Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures

by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of

over-current levels and other abnormal operating conditions.

■ Precautions Related to Usage of Devices

Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office

equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).

Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human

lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace

systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested

to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without

prior approval.

7.2 Precautions for Package Mounting

Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you

should only mount under Cypress’s recommended conditions. For detailed information about mount conditions, contact your sales

representative.

■ Lead Insertion Type

Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or

mounting by using a socket.

Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow

soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected

to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress recom-

mended mounting conditions.

If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterio-

ration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified

before mounting.

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